ACCESSORY: Big Shot - Precision Base Plate for Wafer-Thin Dies

Constructed of high-quality annealed steel, the Base Plate allows for precise die-cutting of Sizzix chemically-etched, wafer-thin dies (Framelits, Thinlits and Triplits) in the BIGkick, Big Shot and Vagabond machines. With the Base Plate, you can cut through many different materials, including burlap, craft plastic, craft metal, fabric, aluminum, canvas, lightweight suede and thin cork. The Precision Base Plate protects dies from warping while improving their performance: most dies can be cut in a single pass through the machine

Tips and Tricks • To increase the life of the cutting pad used in conjunction with the Precision Base Plate users need to rotate the placement location of the die on the cutting pad. Do not place the die in the same place every time this will greatly reduce the useful life of the cutting pads. Instead rotate the dies orientation on the cutting pad so that it rotates all around the cutting pad. After each cut flip the top cutting pad and use the opposite side. • The PBP is not a replacement for the bottom cutting pad it should only be used with intricate Thinlit dies. • Do not add shims to the Precision Base Plate sandwich. If an intricate Thinlit die does not completely cut on the first pass, it may require an additional pass to complete the cutting process. • Works with Standard and Extended Platforms only. NOT recommended for use with the Magnetic Platform. • The PBP is NOT recommended for use with the Big Shot Plus. The Big Shot Plus has step rollers technology and does not require the additional metal plate to cut intricate dies.